Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a bonding pad structure

Method of forming a bonding pad structure

US Patent 7067928 · Granted Jun 27, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of manufacturing semiconductor device2012
Semiconductor device2012
Semiconductor device and semiconductor device manufacturing method2012
Semiconductor device and method of manufacturing semiconductor device2011
Method of forming a bonding pad structure2007
Method for manufacturing a semiconductor device2005
Manufacture method for semiconductor device with small variation in MOS threshol2005
Multi-layer wiring structure of integrated circuit and manufacture of multi-laye2003
Manufacture method for semiconductor with small variation in MOS threshold volta2003
Bonding pad structure of semiconductor device2001
Method of fabricating semiconductor device2001
Semiconductor device having manufacturing wiring structure with buried plugs2000