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Home › Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer

Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer

US Patent 7030479 · Granted Apr 18, 2006

Estimated economic value: $13,047,000 ⓘ

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Integrated circuit die and/or package having a variable pitch contact array for 2003
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