Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

US Patent 7023082 · Granted Apr 4, 2006

Estimated economic value: $351,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor chip package2009
Wafer stacking package method2009
Semiconductor package and method for manufacturing the same2008
Multi-chip package structure2007
Multi-chip package structure2007
Process for sawing substrate strip2007
Semiconductor chip package2006
Quad flat non-leaded package2006
Multi-chip package structure2006
Leadless semiconductor package2006
Wafer-level package structure2006
Semiconductor package and method for manufacturing the same2006