Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions

Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions

US Patent 7017382 · Granted Mar 28, 2006

Estimated economic value: $12,093,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

ECAE processing for high strength and high hardness aluminum alloys2025
Profiled sputtering target and method of making the same2025
Device for visible puncture2024
W-band E-plane waveguide bandpass filter2023
ECAE processing for high strength and high hardness aluminum alloys2023
Large-grain tin sputtering target2022
ECAE materials for high strength aluminum alloys2022
Endoscope2022
Frictionless forged aluminum alloy sputtering target with improved properties2022
ECAE materials for high strength aluminum alloys2022
Profiled sputtering target and method of making the same2022
Method of forming copper alloy sputtering targets with refined shape and microst2021