Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for forming a buried cavity in a semiconductor material wafer and a buried cavity

Process for forming a buried cavity in a semiconductor material wafer and a buried cavity

US Patent 6992367 · Granted Jan 31, 2006

Estimated economic value: $10,599,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing a capacitive pressure sensor and capacitive pressure se2025
Semiconductor device and method for manufacturing a semiconductor device2024
MEMS piezoelectric device and corresponding manufacturing process2024
Thermoelectric generator2024
Method of fabrication of an integrated thermoelectric converter, and integrated 2023
MEMS piezoelectric device and corresponding manufacturing process2022
Process for manufacturing a MEMS micromirror device, and associated device2022
Integrated optical device with a waveguide and related manufacturing process2022
Integrated optical device with a waveguide and related manufacturing process2022
Process for manufacturing a microelectromechanical device having a suspended bur2021
Process for manufacturing a microelectromechanical device having a suspended bur2021
Semiconductor die with buried capacitor, and method of manufacturing the semicon2021