Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip package having a contiguous heat spreader assembly

Multi-chip package having a contiguous heat spreader assembly

US Patent 6963129 · Granted Nov 8, 2005

Estimated economic value: $4,951,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System packaging for cellular modem and transceiver system of heterogeneous stac2025
Molded silicon on passive package2024
Adjustable sub-base mounting assembly for installing a pump2022
Structure and method for hybrid optical package with glass top cover2019
Optical sensor having a light emitter and a photodetector assembly directly moun2017
Embedded die redistribution layers for active device2016
Sacrificial pad on semiconductor package device and method2016
Wafer level lens in package2016
Stacked LED for optical sensor devices2015
Semiconductor structure and method for interconnection of integrated circuits2014
Integrated circuit packaging devices and methods2014
Semiconductor structure and method for interconnection of integrated circuits2013