Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with heat sink

Semiconductor package with heat sink

US Patent 6956741 · Granted Oct 18, 2005

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Remote controller and paring method thereof2019
ISM-band printed antenna for a portion of a circuit board2008
Method of manufacturing semiconductor packages and a clamping device for manufac2005
Encapsulated semiconductor package free of chip carrier2005
Test fixture for semiconductor package and test method of using the same2005
Semiconductor package and method for fabricating the same2004
Method for forming a bottom polysilicon electrode of a stacked capacitor for DRA2000
Method of fabricating thin O/N/O stacked dielectric for high-density DRAMs1996