Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for reducing He backside faults during wafer processing

Method and apparatus for reducing He backside faults during wafer processing

US Patent 6899109 · Granted May 31, 2005

Estimated economic value: $14,324,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Platen for cut sheet feeder2009
Cut sheet feeder2009
Methods and apparatus for the optimization of highly selective process gases2009
Method and apparatus for reducing He backside faults during wafer processing2004
Techniques for improving etching in a plasma processing chamber2002
Mechanism for bow reduction and critical dimension control in etching silicon di2001
Method for etching silicon dioxide using fluorocarbon gas chemistry2000
Methods for selective plasma etch2000