Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic component with stacked semiconductor chips

Electronic component with stacked semiconductor chips

US Patent 6894378 · Granted May 17, 2005

Estimated economic value: $57,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for connecting at least one chip to an external wiring conf2006
Method for applying a semiconductor chip to a carrier element2006
Electronic component with a semiconductor chip and method of producing an electr2005
Apparatus for applying a semiconductor chip to a carrier element with a compensa2003
Lead frame for the installation of an integrated circuit in an injection-molded 2003
Method for mounting a semiconductor chip on a carrier layer and device for carry2003
Electronic devices and a sheet strip for packaging bonding wire connections of e2003
Device for packaging electronic components2003
Chip carrier having ventilation channels2002
Method for bonding conductors, in particular beam leads2002
Semiconductor component with method for manufacturing2002
Method for singling semiconductor components and semiconductor component singlin2002