Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape

Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape

US Patent 6869264 · Granted Mar 22, 2005

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stack type ball grid array package and method for manufacturing the same2011
Structure for joining a semiconductor package to a substrate using a solder colu2009
Method and apparatus for picking up a semiconductor chip, method and apparatus f2008
Stack type ball grid array package and method for manufacturing the same2007
Method and apparatus for picking up a semiconductor chip, method and apparatus f2007
Semiconductor device and method of packaging the same2007
Double-sided circuit board and multi-chip package including such a circuit board2007
Protective tape removing apparatus and method of assembling semiconductor packag2006
Semiconductor device and method of packaging the same2006
Cleaner for molding apparatus of semiconductor chip packages2004