Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi chip module

Multi chip module

US Patent 6858930 · Granted Feb 22, 2005

Estimated economic value: $4,371,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optically aligned hybrid semiconductor device and method2020
Low CTE interposer2019
Optically aligned hybrid semiconductor device and method2019
Low cost hybrid high density package2018
Low CTE interposer2017
Optically aligned hybrid semiconductor device and method2017
Molded glass lid for wafer level packaging of opto-electronic assemblies2017
Coupling light from a waveguide array to single mode fiber array2017
Low cost hybrid high density package2016
Single mode fiber array connector for opto-electronic transceivers2016
Low-stress TSV design using conductive particles2016
Arrangement for placement and alignment of opto-electronic components2016