Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High performance heat sink configurations for use in high density packaging applications

High performance heat sink configurations for use in high density packaging applications

US Patent 6845010 · Granted Jan 18, 2005

Estimated economic value: $67,033,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Medical devices incorporating thermoelectric transducer and controller2019
Bioreactor2018
Microscale cooling apparatus and method2014
Medical devices incorporating thermoelectric transducer and controller2012
Fan integrated thermal management device2009
Method, apparatus and system for enclosure enhancement2009
Spring loaded heat sink retention mechanism2009
Rake shaped fan2008
Method of attaching non-adhesive thermal interface materials2006
Heat sink and package surface design2005
Heat sink and package surface design2004
Heat-dissipating devices, systems, and methods with small footprint2003