Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Seri Lee — 16 Patents

Intel: 12 patents #3,451 of 30,777Top 15%
SNScion Neurostim: 2 patents #5 of 9Top 60%
NUNanyang Technological University: 1 patents #385 of 1,285Top 30%
Overall (All Time): #284,196 of 4,157,543Top 7%
16 Patents All Time
Seri Lee has been granted 16 US patents while listed as an inventor at Intel. The first was granted in 2002 and the most recent in August 2019. Seri Lee ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Seri Lee in Singapore, HI, SG.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10390991 Medical devices incorporating thermoelectric transducer and controller Lesco L. Rogers, Jesko von Windheim 2019-08-27
9930842 Bioreactor Wai Man LAU 2018-04-03
8833435 Microscale cooling apparatus and method Matthew Determan, Scott W. Lee, Abel Manuel Siu Ho 2014-09-16
8267983 Medical devices incorporating thermoelectric transducer and controller Lesco L. Rogers, Jesko von Windheim 2012-09-18
7535708 Fan integrated thermal management device 2009-05-19 $16,372,000
7499274 Method, apparatus and system for enclosure enhancement Scott Noble 2009-03-03 $13,073,000
7495922 Spring loaded heat sink retention mechanism Johan F. Ploeg 2009-02-24 $15,365,000
7321184 Rake shaped fan Ioan Sauciuc 2008-01-22 $26,995,000
7019977 Method of attaching non-adhesive thermal interface materials Seung-Mook You, Jae Won Chang 2006-03-28 $11,012,000
6870736 Heat sink and package surface design Phillip Chen 2005-03-22 $25,941,000
6845010 High performance heat sink configurations for use in high density packaging applications 2005-01-18 $67,033,000
6757170 Heat sink and package surface design Phillip Chen 2004-06-29 $34,137,000
6633484 Heat-dissipating devices, systems, and methods with small footprint Lloyd L. Pollard, II 2003-10-14 $51,971,000
6535385 High performance heat sink configurations for use in high density packaging applications 2003-03-18 $38,669,000
6501655 High performance fin configuration for air cooled heat sinks Lloyd L. Pollard, II 2002-12-31 $37,060,000
6479895 High performance air cooled heat sinks used in high density packaging applications Lloyd L. Pollard, II, Craig Randleman 2002-11-12 $72,895,000