Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density

Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density

US Patent 6835117 · Granted Dec 28, 2004

Estimated economic value: $11,084,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Technique to perform neural network architecture search2025
Representational disentanglement for multi-modality image completion using neura2025
Object detection using one or more neural networks2025
Pretraining framework for neural networks2025
Methods and compositions for chimeric antigen receptor targeting cancer cells2025
Signaling sending method and device, and signaling receiving method and device2024
Signal transmission method and device, and computer storage medium2024
Method and apparatus for configuring reference signal channel characteristics, a2024
Method and device for configuring reference signal2023
Method and apparatus for information reporting, and method and apparatus for inf2023
System and method for allocating resources2023
Signal transmission method and device, and computer storage medium2023