Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for performing whole wafer burn-in

Method and apparatus for performing whole wafer burn-in

US Patent 6830940 · Granted Dec 14, 2004

Estimated economic value: $1,723,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectromechanical actuator on insulating substrate2025
Microchannel valve apparatus, system, and method2025
Microelectromechanical actuator on insulating substrate2024
Light based therapy devices and methods2020
Light based therapy devices and methods2020
Method for manufacturing semiconductor devices having gallium nitride epilayers 2015
Method for manufacturing semiconductor devices having gallium nitride epilayers 2012
Semiconductor devices having gallium nitride epilayers on diamond substrates2012
Composite wafers having bulk-quality semiconductor layers and method of manufact2011
Semiconductor devices having gallium nitride epilayers on diamond substrates2009
Method and apparatus for performing whole wafer burn-in2006
Method and apparatus for performing whole wafer burn-in2006