Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof

Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof

US Patent 7943485 · Granted May 17, 2011

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for the improvement of attitude control system testbeds for sm2025
System and method for illumination source identification2025
Microelectromechanical actuator on insulating substrate2025
Microchannel valve apparatus, system, and method2025
Wideband-tunable RF receiver with high dynamic range and high out-of-band reject2025
Microelectromechanical actuator on insulating substrate2024
Harmonic filters for polar modulators2024
Wireless transmitter with improved thermal management2023
Wireless communication system with improved thermal performance2022
Wireless communication system with improved thermal performance2022
Mounting of semiconductor-on-diamond wafers for device processing2022
Apparatus for efficient high-frequency communications2021