Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged

Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged

US Patent 6781248 · Granted Aug 24, 2004

Estimated economic value: $1,093,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carrierless chip package for integrated circuit devices, and methods of making s2017
Redistribution elements and semiconductor device packages including semiconducto2014
Interposer structure with embedded capacitor structure, and methods of making sa2014
Methods of forming semiconductor device packages including a semiconductor devic2013
Semiconductor device packages including a semiconductor device and a redistribut2012
Stacked die package for peripheral and center device pad layout device2012
Semiconductor device packages and assemblies2012
Stacked die package for peripheral and center device pad layout device2010
Packaged IC device comprising an embedded flex circuit on leadframe, and methods2010
Build-up-package for integrated circuit devices, and methods of making same2010
Method for fabricating semiconductor package with multi-layer die contact and ex2009
Carrierless chip package for integrated circuit devices, and methods of making s2009