Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonding pad structure

Bonding pad structure

US Patent 6710448 · Granted Mar 23, 2004

Estimated economic value: $2,485,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wooden newel with a clean surface and preparation method thereof2025
Diffusive gradients in thin films (DGT) test device for lake water and test meth2024
Stylus holders2023
Diffusive gradients in thin films (DGT) probe test device for sediment core in l2023
Radio frequency (RF) transistor amplifier packages with improved isolation and l2023
Rolling elements-based pivoting supports for keyboards2022
Wireless chargers2020
Precision lapping and polishing device for external cylindrical surface of the d2019
Hinge for foldable components2019
Preparation of metal oxide-graphene composite films2018
Method and the device for making high precision coating of insert for glass mold2009
Semiconductor chip capable of implementing wire bonding over active circuits2008