Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of applying a bottom surface protective coating to a wafer, and wafer dicing method

Method of applying a bottom surface protective coating to a wafer, and wafer dicing method

US Patent 6709953 · Granted Mar 23, 2004

Estimated economic value: $78,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polarised emission from quantum wires in cubic GaN2025
Zincblende structure group III-nitride2023
Zincblende structure group III-nitride2022
Crack stop barrier and method of manufacturing thereof2019
Crack stop barrier and method of manufacturing thereof2017
Crack stop barrier and method of manufacturing thereof2016
Crack stop barrier and method of manufacturing thereof2014
P-type semiconductor devices2013
Stacked die module2012
Mechanically reconfigurable vertical tester interface for IC probing2010
Method for producing a rewiring printed circuit board2008
Method for producing an electronic component, especially a memory chip2008