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Home › Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit

Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit

US Patent 6660406 · Granted Dec 9, 2003

Estimated economic value: $196,000 ⓘ

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