{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method and apparatus for testing a semiconductor package", "item": "https://www.patentleaderboard.com/patent/6628136"}]}
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Home › Method and apparatus for testing a semiconductor package

Method and apparatus for testing a semiconductor package

US Patent 6628136 · Granted Sep 30, 2003

Estimated economic value: $3,105,000 ⓘ

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