{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for optimizing the planarizing length of a polishing pad", "item": "https://www.patentleaderboard.com/patent/6620031"}]}
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Home › Method for optimizing the planarizing length of a polishing pad

Method for optimizing the planarizing length of a polishing pad

US Patent 6620031 · Granted Sep 16, 2003

Estimated economic value: $7,681,000 ⓘ

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