Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-frequency integrated inductive winding

High-frequency integrated inductive winding

US Patent 6617665 · Granted Sep 9, 2003

Estimated economic value: $23,304,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip protected against back-face attacks2024
Chip protected against back-face attacks2021
Semiconductor device comprising a capacitor and an electrical connection via and2014
Integrated circuit comprising a device with a vertical mobile element integrated2014
Interface plate between integrated circuits2014
MIM capacitor with enhanced capacitance2013
Integrated microelectronic device with through-vias2013
Fabrication of a diffusion barrier cap on copper containing conductive elements2012
Method for forming metal interconnects in a dielectric material2012
Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect el2011
On-chip interconnect-stack cooling using sacrificial interconnect segments2011
Process for fabricating an integrated electronic circuit that incorporates air g2007