Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for removing photoresist edge beads from thin film substrates

Apparatus for removing photoresist edge beads from thin film substrates

US Patent 6614507 · Granted Sep 2, 2003

Estimated economic value: $4,674,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Clamping mechanism for a two wheel panel dolly2014
Wafer edge defect inspection using captured image analysis2011
Yield profile manipulator2011
Wafer edge expose alignment method2010
Method for calculating high-resolution wafer parameter profiles2010
Nanotube fuse structure2009
Voltage contrast monitor for integrated circuit defects2009
Apparatus for wafer patterning to reduce edge exclusion zone2008
Yield profile manipulator2008
Voltage contrast monitor for integrated circuit defects2008
Surface coordinate system2008
Wafer edge structure measurement method2007