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Home › Slot via filled dual damascene interconnect structure without middle etch stop layer

Slot via filled dual damascene interconnect structure without middle etch stop layer

US Patent 6603206 · Granted Aug 5, 2003

Estimated economic value: $3,941,000 ⓘ

Assignee

AMD

Inventors

Fei Wang (240 patents)
Lynne A. Okada (37 patents)
Ramkumar Subramanian (251 patents)
Calvin T. Gabriel (101 patents)

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