Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect assembly for an electronic assembly and assembly method therefor

Interconnect assembly for an electronic assembly and assembly method therefor

US Patent 6575765 · Granted Jun 10, 2003

Estimated economic value: $2,610,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid cooled electronics assembly suitable to use electrically conductive coola2014
Semiconductor power module with flexible circuit leadframe2011
Fluid cooled semiconductor power module having double-sided cooling2010
Dual-sided substrate integrated circuit package including a leadframe having lea2010
Power semiconductor package having integral fluid cooling2009
Vertical laminated electrical switch circuit2008
Electronics assembly having multiple side cooling and method2007
Dual-sided substrate integrated circuit package including a leadframe having lea2006
Electrically isolated and thermally conductive double-sided pre-packaged compone2006
Electrically isolated and thermally conductive double-sided pre-packaged compone2004
Automotive electronics heat exchanger2003
Parallel dual switch module2000