Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for high-pressure wafer processing and drying

Method and apparatus for high-pressure wafer processing and drying

US Patent 6543156 · Granted Apr 8, 2003

Estimated economic value: $1,048,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrochemical depositions of nanotwin copper materials2025
Self-sealing fluid connectors2025
Portable apparatus for oxygen delivery2025
Systems and methods for detection of potential health issues2025
Thermal protection system for a dialysate container2024
Parameter adjustment model for semiconductor processing chambers2024
Systems and methods for shielding features of a workpiece during electrochemical2024
Electroplating system2024
Nanotwin copper materials in semiconductor devices2024
Diffusion layers in metal interconnects2024
Substrate cleaning components and methods in a plating system2023
Fluid recovery in semiconductor processing2023