Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multichip module substrates with buried discrete capacitors and components and methods for making

Multichip module substrates with buried discrete capacitors and components and methods for making

US Patent 6535398 · Granted Mar 18, 2003

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for cooling a computer2017
Method and an apparatus for cooling a computer2014
Method and an apparatus for cooling a computer2011
Method and an apparatus for cooling a computer2009
Method and an apparatus for cooling a computer2006
Molded memory module and method of making the module absent a substrate support2005
Method and apparatus for encoding information in an IC package2004
Methods of planarizing structures on wafers and substrates by polishing2004
Thermo-electric signal coupler2003
Socketable BGA package2002
Method for optimizing cost of manufacturing memory arrays2001
Flexible foil finned heatsink structure and method of making same2001