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Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil

US Patent 6531045 · Granted Mar 11, 2003

Estimated economic value: $39,000 ⓘ

Assignee

Mitsui Mining & Smelting Co.

Inventors

Masakazu Mitsuhashi (48 patents)
Takashi Kataoka (65 patents)
Naotomi Takahashi (16 patents)

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