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Home › Via filled dual damascene structure with middle stop layer and method for making the same

Via filled dual damascene structure with middle stop layer and method for making the same

US Patent 6521524 · Granted Feb 18, 2003

Estimated economic value: $2,713,000 ⓘ

Assignee

AMD

Inventors

Fei Wang (240 patents)
Lynne A. Okada (37 patents)
Ramkumar Subramanian (251 patents)
Calvin T. Gabriel (101 patents)

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