Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermosonic bonding apparatus, tool, and method

Thermosonic bonding apparatus, tool, and method

US Patent 6520399 · Granted Feb 18, 2003

Estimated economic value: $19,499,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carbon monoxide detection assembly2017
Method of assigning one or more spreading sequences to users of a multi carrier 2008
MC-CDMA downlink transmission method2008
High current, low impedance resistance welding device2004
Modular ceramic igniter with metallized coatings on the end portions thereof and1998
Method for testing encapsulation integrity1991
Laser process apparatus1989
Aluminum wire ball bonding apparatus and method1983
Method and apparatus for ultrasonic bonding1983