Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for ultrasonic bonding

Method and apparatus for ultrasonic bonding

US Patent 4373653 · Granted Feb 15, 1983

Estimated economic value: $10,035,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carbon monoxide detection assembly2017
Method of assigning one or more spreading sequences to users of a multi carrier 2008
MC-CDMA downlink transmission method2008
High current, low impedance resistance welding device2004
Thermosonic bonding apparatus, tool, and method2003
Modular ceramic igniter with metallized coatings on the end portions thereof and1998
Broadband communications RF packet collision detection1990
Discrete fourier transform direction finding apparatus1989
Laser process apparatus1989
Quadrature signal generator having digitally-controlled phase and amplitude corr1987
MSK surface acoustic wave convolver1986
Aluminum wire ball bonding apparatus and method1983