Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etching process for forming the trench with high aspect ratio

Etching process for forming the trench with high aspect ratio

US Patent 6518164 · Granted Feb 11, 2003

Estimated economic value: $2,214,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit layout2015
Semiconductor device2015
Stacked chip system2014
Method for fabricating a through-silicon via2014
Etching procedure for floating gate formation of a flash memory device2003
Method for forming dual damascene structure2001
Method for forming via hole2000
Method of manufacturing interconnect2000
Method of forming unlanded via hole2000
Metallic precipitate monitoring method1999