Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Processing of circuit boards with protective, adhesive-less covers on area array bonding sites

Processing of circuit boards with protective, adhesive-less covers on area array bonding sites

US Patent 6499215 · Granted Dec 31, 2002

Estimated economic value: $15,139,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid metal infiltration rework of electronic assembly2024
Applying a solderable surface to conductive ink2023
Reliability enhancement of press fit connectors2023
Pierced thermal interface constructions2023
Liquid metal infiltration rework of electronic assembly2023
Thermal interface material structures for directing heat in a three-dimensional 2023
Integrated circuit module with a structurally balanced package using a bottom si2023
Reliability enhancement of press fit connectors2022
Thermal interface material structures for directing heat in a three-dimensional 2022
Fixture facilitating heat sink fabrication2022
Liquid metal infiltration rework of electronic assembly2022
Land grid array electrical contact coating2022