Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication and bonding of copper sputter targets

Fabrication and bonding of copper sputter targets

US Patent 6478902 · Granted Nov 12, 2002

Estimated economic value: $11,397,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor die with transformer and ESD clamp circuit2025
Polyphase filter for mm-wave frequencies featuring symmetric layout2016
Polyphase filter for MM-wave frequencies featuring symmetric layout2015
Method for forming sputter target assemblies having a controlled solder thicknes2015
Method for forming sputter target assemblies having a controlled solder thicknes2013
Method for producing porous β-tricalcium phosphate granules2012
Method for forming sputter target assemblies2012
Texture and grain size controlled hollow cathode magnetron targets and method of2010
High-purity ferromagnetic sputter targets and method of manufacture2009
Method of forming bone with porous βtricalcium phosphate granules2008
Method of delivering a bioactive agent with porous β-tricalcium phosphate granul2008
Textured-grain-powder metallurgy tantalum sputter target2006