Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package structure utilizing aluminum nitride/aluminum composite material

Electronic package structure utilizing aluminum nitride/aluminum composite material

US Patent 6465733 · Granted Oct 15, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microwave monolithic integrated circuit assembly with multi-orientation pyrolyti2003
Laser controlled crystal and dielectric resonator oscillators2002
Electronic structure having an embedded pyrolytic graphite heat sink material2000
Electronic structure having an embedded pyrolytic graphite heat sink material2000
Phased array with integrated bandpass filter superstructure2000
Ceramic-polymer composite material and its use in microelectronics packaging1999
Multilayer electronic structure and its preparation1998
Phased array with integrated bandpass filter superstructure1998
Method of making an electronic package structure utilizing aluminum nitride/alum1997
Method of making an electronic package structure utilizing aluminum nitride/alum1997
Method of making an electronic package structure utilizing aluminum nitride/alum1997
Method of making an electronic package structure utilizing aluminum nitride/alum1997