Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465733 | Electronic package structure utilizing aluminum nitride/aluminum composite material | M. Akbar Ali, Carl W. Peterson, Hutan Taghavi | 2002-10-15 |
| 5688450 | Method of making an electronic package structure utilizing aluminum nitride/aluminum composite material | M. Akbar Ali, Carl W. Peterson, Hutan Taghavi | 1997-11-18 |
| 5382309 | Method of making a fiber reinforced ceramic glass composites having tailored coefficient of thermal expansion | Robert W. Seibold, James O. Gibson | 1995-01-17 |
| 5229196 | Fiber reinforced ceramic glass composites having tailored coefficient of thermal expansion | Robert W. Seibold, James O. Gibson | 1993-07-20 |