Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad

Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad

US Patent 6462414 · Granted Oct 8, 2002

Estimated economic value: $18,181,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of fabricating an integrated circuit package utilizing a conductive struc2005
Semiconductor package with improved thermal cycling performance, and method of f2003