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Home › Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method

Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method

US Patent 6440827 · Granted Aug 27, 2002

Estimated economic value: $68,000 ⓘ

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