Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure and method for redeposition free thin film CPP read sensor fabrication

Structure and method for redeposition free thin film CPP read sensor fabrication

US Patent 6433970 · Granted Aug 13, 2002

Estimated economic value: $354,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

III-N devices with improved reliability2025
Segmented multi-channel, backside illuminated, solid state detector with a throu2023
High reliability semiconductor devices and methods of fabricating the same2022
Conditions for burn-in of high power semiconductors2019
Imaging apparatus having a plurality of movable beam columns, and method of insp2018
Method of forming a fully wrapped-around shielded PMR writer pole2016
Method for fabricating a magnetic write pole having a leading edge bevel2016
High-voltage energy-dispersive spectroscopy using a low-voltage scanning electro2015
Methods for manufacturing electronic lapping guides for writer heads that closel2015
Method for fabricating a magnetic writer having half-side shields2015
Method for providing a magnetic recording transducer using a combined main pole 2015
Method for providing a side shield for a magnetic recording transducer2015