Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Programmable thermal management of an integrated circuit die

Programmable thermal management of an integrated circuit die

US Patent 6393374 · Granted May 21, 2002

Estimated economic value: $83,641,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Granular GPU DVFS with execution unit partial powerdown2025
Granular GPU DVFS with execution unit partial powerdown2025
Stacked semiconductor die architecture with multiple layers of disaggregation2025
Thermal management in horizontally or vertically stacked dies2025
Apparatus and method for temperature-constrained frequency control and schedulin2025
System, apparatus and method for providing hardware state feedback to an operati2024
Dual loop voltage regulator2024
Apparatuses and methods for a processor architecture2024
Per-part real-time load-line measurement apparatus and method2024
Power-forwarding bridge for inter-chip data signal transfer2024
Stacked semiconductor die architecture with multiple layers of disaggregation2024
Hardware directed core parking based on performance and energy efficiency capabi2024