Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integral design features for heatsink attach for electronic packages

Integral design features for heatsink attach for electronic packages

US Patent 6373703 · Granted Apr 16, 2002

Estimated economic value: $14,535,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Current management and termination2025
DC busbar system, laminated DC busbar and DC backplane with super low inductance2025
Method and assemblies for repair of plastic fuel lock ring and fuel supply line2025
COVID-19 vaccine2025
Cooling system with common modular manifolds2025
Cooling systems and methods for cooling contactors2025
Modified clostridial neurotoxins as vaccines and conjugate vaccine platforms2022
Fire sprinkler with integrated shut off valve2022
Network element association using network data2022
Active internal air cooled vehicle battery pack2021
Neurotoxins and uses thereof2020
Hybrid neurotoxins and uses thereof2020