Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Underfill encapsulants prepared from allylated amide compounds

Underfill encapsulants prepared from allylated amide compounds

US Patent 6350840 · Granted Feb 26, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

UV light curable adhesive and device with UV light curable adhesive2023
Reactive conductive pressure-sensitive adhesive tape2017
Reactive film adhesive2016
Radiation curable temporary laminating adhesive for use in high temperature appl2014
Tablet excipient2014
Thermally reversible hot melt adhesive composition containing multifunctional di2014
Polymeric photoinitiators2010
Polymeric photoinitiators2010
Radiation-curable desiccant-filled adhesive/sealant2010
Sulfonium salt photoinitiators and use thereof2009
Blends of different acyl gellan gums and starch2009
Radiation-curable desiccant-filled adhesive/sealant2008