Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of cleansing vias in semiconductor wafer having metal conductive layer

Method of cleansing vias in semiconductor wafer having metal conductive layer

US Patent 6319842 · Granted Nov 20, 2001

Estimated economic value: $46,991,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Glass pallet for sputtering systems2025
Electrochromic window fabrication methods2025
Self-contained EC IGU2025
Tintable window system useable as a display for a user interface by an authorize2025
Counter electrode for electrochromic devices2025
Methods of controlling multi-zone tintable windows2025
Building network2025
Thin-film devices and fabrication2025
Displays for tintable windows2025
Thin-film devices and fabrication2025
Control methods and systems using external 3D modeling and schedule-based comput2025
Electrochromic cathode materials2025