Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of post CMP defect stability improvement

Method of post CMP defect stability improvement

US Patent 6319098 · Granted Nov 20, 2001

Estimated economic value: $71,675,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Passive acoustic monitoring and acoustic sensors for chemical mechanical polishi2025
Determining substrate orientation with acoustic signals2025
Chemical mechanical polishing vibration measurement using optical sensor2025
Determining substrate precession with acoustic signals2025
Control of processing parameters for substrate polishing with substrate precessi2025
Machine vision as input to a CMP process control algorithm2025
Training spectrum generation for machine learning system for spectrographic moni2024
Control of processing parameters for substrate polishing with angularly distribu2024
Consumable part monitoring in chemical mechanical polisher2024
Polishing system with annular platen or polishing pad2023
Monitoring of polishing pad texture in chemical mechanical polishing2023
Monitoring of vibrations during chemical mechanical polishing2023