Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Encapsulated power supply with a high thermal conductivity molded insert

Encapsulated power supply with a high thermal conductivity molded insert

US Patent 6317324 · Granted Nov 13, 2001

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Packaging techniques for a high-density power converter2009
Packaging techniques for a high-density power converter2005
Top mounted cooling device using heat pipes2002
Top mounted cooling device using heat pipes2002
Miniature liquid transfer pump and method of manufacturing same2002
Miniature liquid transfer pump and method of manufacturing same2002
Header, a method of manufacture thereof and an electronic device employing the s2002
Header, a method of manufacture thereof and an electronic device employing the s2002
Fixed conductive pin for printed wiring substrate electronics case and method of2001
Fixed conductive pin for printed wiring substrate electronics case and method of2001
Circuit board apparatus2001
Circuit board apparatus2001