| 6394175 |
Top mounted cooling device using heat pipes |
Roger J. Hooey |
2002-05-28 |
| 6386844 |
Miniature liquid transfer pump and method of manufacturing same |
Roger J. Hooey |
2002-05-14 |
| 6377466 |
Header, a method of manufacture thereof and an electronic device employing the same |
Roger J. Hooey |
2002-04-23 |
| 6320762 |
Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor |
Roger J. Hooey |
2001-11-20 |
| 6317324 |
Encapsulated power supply with a high thermal conductivity molded insert |
Roger J. Hooey |
2001-11-13 |
| 6301120 |
Circuit board apparatus |
Roger J. Hooey, Thang D. Truong |
2001-10-09 |
| 6263957 |
Integrated active cooling device for board mounted electric components |
Roger J. Hooey, Robert E. Radke |
2001-07-24 |
| 6206708 |
Through via plate electrical connector and method of manufacture thereof |
Roger J. Hooey, Robert E. Radke |
2001-03-27 |
| 6181577 |
Auxiliary bias circuit for a power supply and a method of operation thereof |
Feng Lin |
2001-01-30 |
| 6165596 |
Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components |
Robert E. Radke |
2000-12-26 |
| 6144557 |
Self-locking conductive pin for printed wiring substrate electronics case |
Roger J. Hooey |
2000-11-07 |
| 6083772 |
Method of mounting a power semiconductor die on a substrate |
Wayne C. Bowman |
2000-07-04 |
| 6061260 |
Board mounted power supply having an auxiliary output |
Feng-Wei Lin |
2000-05-09 |
| 6034441 |
Overcast semiconductor package |
— |
2000-03-07 |
| 5872403 |
Package for a power semiconductor die and power supply employing the same |
Wayne C. Bowman |
1999-02-16 |
| 5804952 |
Encapsulated package for a power magnetic device and method of manufacture therefor |
— |
1998-09-08 |
| 5659462 |
Encapsulated, integrated power magnetic device and method of manufacture therefor |
Ashraf W. Lotfi, Robert Joseph Roessler, John D. Weld |
1997-08-19 |