Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a self-aligned contact hole on a semiconductor wafer

Method of forming a self-aligned contact hole on a semiconductor wafer

US Patent 6306760 · Granted Oct 23, 2001

Estimated economic value: $539,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Manufacturing method of static random access memory2009
SRAM cell structure and manufacturing method thereof2008
SRAM cell structure and manufacturing method thereof2008
SRAM cell structure and manufacturing method thereof2007
SRAM cell structure and manufacturing method thereof2007
Non-volatile memory and manufacturing method thereof2006
Method for forming a gate with metal silicide2004
Method for forming a gate with metal silicide2004
Method for combining logic circuit and capacitor2001
Method for forming a transistor with reduced source/drain series resistance2001
Method of fabricating a silicide landing pad2001
Manufacturing method of a bottom plate2001