Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor lead frame and package with stiffened mounting paddle

Semiconductor lead frame and package with stiffened mounting paddle

US Patent 6303985 · Granted Oct 16, 2001

Estimated economic value: $7,511,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die attached to a support member by a plurality of adhesive members2015
Methods of adhering microfeature workpieces, including a chip, to a support memb2012
Methods and systems for removing protective films from microfeature workpieces2010
Microfeature systems including adhered microfeature workpieces and support membe2009
Methods relating to forming interconnects2007
Semiconductor component assemblies having interconnects2007
Methods relating to forming interconnects and resulting assemblies2006
Folded interposer2006
Thin microelectronic substrates and methods of manufacture2005
Folded interposer2005
Thin microelectronic substrates and methods of manufacture2004
Thin microelectronic substrates and methods of manufacture2001