Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer and method for manufacturing semiconductor devices

Semiconductor wafer and method for manufacturing semiconductor devices

US Patent 6303470 · Granted Oct 16, 2001

Estimated economic value: $3,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polycarbonate resin composition, method for producing the same, masterbatch pell2024
Basic magnesium sulfate powder, method for manufacturing basic magnesium sulfate2021
Degassing hole formation process and degassing hole formation apparatus for seco2018
Fine magnesium oxide particle dispersion liquid and method for producing same2018
Magnesium oxide material,thermally conductive filler and thermally conductive re2018
Semiconductor device comprising light-emitting element and light-receiving eleme2012
Semiconductor wafer, and semiconductor device formed therefrom2012
Semiconductor wafer, and semiconductor device formed therefrom2011
Semiconductor device having a frame portion and an opening portion with mountabl2010
Method of manufacturing chip size package semiconductor device without intermedi2009
Semiconductor device having chip size package with improved strength2008
Semiconductor device with connections for bump electrodes2007